? semiconductor components industries, llc, 2013 may, 2013 ? rev. 3 1 publication order number: cm1693/d cm1693-04de, cm1693-06de, CM1693-08DE l-c lcd and camera emi filter array with esd protection product description the cm1693 is a family of pi ? style emi filter arrays with esd protection, which integrates four, six or eight filters (c ? l ? c) into a small ? form factor , udfn 0.40 mm pitch package. each emi filter channel is implemented as a 3 ? pole l ? c filter, where the component values are 10 pf ? 26 nh ? 12 pf. the cm1693?s roll ? off frequency at ? 6 db attenuation is 300 mhz and can be used in applications where the data rates are as high as 140 mbps. the cm1693 also provides greater than ? 30 db attenuation over the 800 mhz to 6 ghz frequency range. the device includes esd diodes on every pin that provide a very high level of protection for sensitive electronic components against possible electrostatic discharge (esd). the esd protection diodes connected to the filter ports are designed and characterized to safely dissipate esd strikes of 18 kv, which is beyond the maximum requirement of the iec61000 ? 4 ? 2 international standard. this device is particularly well suited for wireless handsets, mobile lcd modules and pdas because of its small package format and easy ? to ? use pin assignments. in particular, the cm1693 is ideal for emi filtering and protecting data and control lines for the lcd display and camera interface in mobile handsets. the cm1693 is housed in space saving, low profile, 0.40 mm pitch udfn packages in a rohs compliant, pb ? free format. features ? 4, 6 or 8 channels of emi filtering with integrated esd protection ? pi ? style emi filters in a capacitor ? inductor ? capacitor (c ? l ? c) network ? +18 kv esd protection on each channel (iec 61000 ? 4 ? 2 level 4, contact discharge) ? greater than ? 35 db attenuation (typical) at 1ghz ? udfn lead ? free package with 0.40 mm lead pitch: ? 4 ? ch. = 8 ? lead udfn ? 6 ? ch. = 12 ? lead udfn ? 8 ? ch. = 16 ? lead udfn ? udfn package size: ? 8 ? lead: 1.70 mm x 1.35 mm ? 12 ? lead: 2.50 mm x 1.35 mm ? 16 ? lead: 3.30 mm x 1.35 mm ? increased robustness against vertical impacts during manufacturing process ? these devices are pb ? free and are rohs compliant applications ? lcd and camera data lines in mobile handsets ? i/o port protection for mobile handsets, notebook computers, pdas etc. ? handheld pcs/pdas ? lcd and camera modules ? emi filtering for data ports in cell phones, pdas or notebook computers. ? wireless handsets marking diagram device package shipping ? ordering information udfn8 de suffix case 517bc electrical schematic http://onsemi.com cm1693 ? 04de udfn ? 8 (pb ? free) 3000/tape & reel 1 of 4, 6 or 8 emi/rfi filter channels with integrated esd protection gnd 10 pf 26 nh 12 pf filter + esdn* filter + esdn* ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. * see package/pinout diagram for expanded pin information cm1693 ? 06de udfn ? 12 (pb ? free) 3000/tape & reel 1 8 1 16 udfn16 de suffix case 517be xxxx = specific device code m = month code = pb ? free package (*note: microdot may be in either location) p93 m 1 1 p938 m udfn12 de suffix case 517bd 1 12 1 p936 m cm1693 ? 08de udfn ? 16 (pb ? free) 3000/tape & reel
cm1693 ? 04de, cm1693 ? 06de, cm1693 ? 08de http://onsemi.com 2 table 1. pin descriptions device pin(s) name description ? 04 ? 06 ? 08 1; 8 1; 12 1; 16 filter1 filter + esd channel 1 2; 7 2; 11 2; 15 filter2 filter + esd channel 2 3; 6 3; 10 3; 14 filter3 filter + esd channel 3 4; 5 4; 9 4; 13 filter4 filter + esd channel 4 5; 8 5; 12 filter5 filter + esd channel 5 6; 7 6; 11 filter6 filter + esd channel 6 7; 10 filter7 filter + esd channel 7 8; 9 filter8 filter + esd channel 8 gnd pad gnd device ground top view (pins down view) bottom view (pins up view) cm1693 ? 04de 8 ? lead udfn package 1 package / pinout diagrams gnd pad 234 8765 1234 8765 p93 (x) single digit date code pin 1 marking gnd pad bottom view (pins up view) single digit date code pin 1 marking p938 (x) 12345678 16 15 14 13 12 11 10 9 14 13 12 11 10 9 16 15 1 2345678 top view (pins down view) cm1693 ? 08de 16 ? lead udfn package 1 2 3 4 5 6 top view (pins down view) bottom view (pins up view) pin 1 marking cm1693 ? 06de 12 ? lead udfn package p936(x) 12 11 10 9 8 7 gnd pad 1 2 3 4 5 6 12 11 10 9 8 7 single digit date code
cm1693 ? 04de, cm1693 ? 06de, cm1693 ? 08de http://onsemi.com 3 specifications table 2. absolute maximum ratings parameter rating units storage temperature range ?65 to +150 c current per inductor 30 ma dc package power rating 500 mw stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. table 3. standard operating conditions parameter rating units operating temperature range ?40 to +85 c table 4. electrical operating characteristics (note 1) symbol parameter conditions min typ max units l channel inductance 26 nh c total total channel capacitance at 2.5 vdc reverse bias, 1 mhz, 30 mvac 17.6 22 26.4 pf v diode standoff voltage i diode = 10 a 5.5 v i leak diode leakage current (reverse bias) v diode = +3.3 v 0.1 1.0 a v sig signal clamp voltage positive clamp negative clamp i load = 10 ma i load = ?10 ma 5.6 ?1.5 6.8 ?0.8 9.0 ? 0.4 v v esd in ? system esd withstand voltage contact discharge per iec 61000 ? 4 ? 2 level 4 (notes 2, 3 and 4) 18 kv r dyn dynamic resistance positive negative 2.3 0.9 f r roll ? off frequency at ? 6 db attenuation z source = 50 , z load = 50 300 mhz 1. t a = 25 c unless otherwise specified. 2. esd applied to input and output pins with respect to gnd, one at a time. 3. clamping voltage is measured at the opposite side of the emi filter to the esd pin (i.e. if esd is applied to pin a1 then cla mping voltage is measured at pin c1). unused pins are left open. 4. these parameters are guaranteed by design and characterization.
cm1693 ? 04de, cm1693 ? 06de, cm1693 ? 08de http://onsemi.com 4 performance information typical filter performance (t a = 25 c, dc bias = 0 v, 50 ohm environment) figure 1. typical filter insertion loss (cm1693) typical diode capacitance vs. input voltage figure 2. filter capacitance vs. input voltage (normalized to capacitance at 0 vdc and 25 c)
cm1693 ? 04de, cm1693 ? 06de, cm1693 ? 08de http://onsemi.com 5 mechanical details udfn ? 08, udfn ? 12 and udfn ? 16 mechanical specifications, 0.4mm the 8 ? lead, 12 ? lead and 16 ? lead, 0.4 mm pitch udfn package dimensions are presented below. table 5. tape and reel specifications part number package size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width ? w reel diameter qty per reel p 0 p 1 cm1693 ? 04de 1.70 x 1.35 x 0.50 1.95 x 1.60 x 0.60 8 mm 178 mm (7 ) 3000 4 mm 4 mm cm1693 ? 06de 2.50 x 1.35 x 0.50 2.75 x 1.60 x 0.60 8 mm 178 mm (7 ) 3000 4 mm 4 mm cm1693 ? 08de 3.30 x 1.35 x 0.50 3.50 x 1.55 x 0.70 12 mm 178 mm (7 ) 3000 4 mm 4 mm ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. ???? ???? ???? ???? ? ? ? ? 0.2 mm p 1 a 0 b 0 p 0 k 0 w
cm1693 ? 04de, cm1693 ? 06de, cm1693 ? 08de http://onsemi.com 6 package dimensions udfn8, 1.7x1.35, 0.4p case 517bc ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.25 mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d d2 e2 bottom view b e 8x 0.10 b 0.05 a c c k 8x note 3 2x 0.10 c pin one reference top view 2x 0.10 c 8x a a1 (a3) 0.05 c 0.05 c c seating plane side view l 8x 1 8 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.15 0.25 d 1.70 bsc d2 1.10 1.30 e 1.35 bsc e2 0.30 0.50 e 0.40 bsc k 0.15 ??? l 0.20 0.30 detail b 1.40 0.25 0.50 1.55 0.40 pitch dimensions: millimeters 0.40 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 1 package outline l1 ??? 0.05 8x a1 a3 ?? ?? 8x
cm1693 ? 04de, cm1693 ? 06de, cm1693 ? 08de http://onsemi.com 7 package dimensions udfn12, 2.5x1.35, 0.4p case 517bd ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.25 mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d d2 e2 bottom view b e 12x 0.10 b 0.05 a c c k note 3 2x 0.10 c pin one reference top view 2x 0.10 c 12x a a1 (a3) 0.05 c 0.05 c c seating plane side view l 12x 1 6 7 12 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.15 0.25 d 2.50 bsc d2 1.90 2.10 e 1.35 bsc e2 0.30 0.50 e 0.40 bsc k 0.15 ??? l 0.20 0.30 2.20 12x 0.25 12x 0.50 1.55 0.40 dimensions: millimeters 0.40 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. recommended detail b ?? ?? ??? 0.05 note 4 detail a pitch soldering footprint* package outline
cm1693 ? 04de, cm1693 ? 06de, cm1693 ? 08de http://onsemi.com 8 package dimensions udfn16, 3.3x1.35, 0.4p case 517be ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.25 mm from the terminal tip. 4. coplanarity applies to the exposed pad as well as the terminals. a b e d d2 e2 bottom view b e 16x 0.10 b 0.05 a c c k note 3 2x 0.10 c pin one reference top view 2x 0.10 c 16x a a1 (a3) 0.05 c 0.05 c c seating plane side view l 16x 1 8 9 16 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 a3 0.13 ref b 0.15 0.25 d 3.30 bsc d2 2.70 2.90 e 1.35 bsc e2 0.30 0.50 e 0.40 bsc k 0.15 ??? l 0.20 0.30 3.00 16x 0.25 16x 0.50 1.55 0.40 dimensions: millimeters 0.40 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. recommended detail b ?? ??? 0.05 note 4 detail a pitch soldering footprint* package outline on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent ? marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 cm1693/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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